Achieve the ultimate in quality control with real-time monitoring
Most leading semiconductor manufacturers in the industry today take great pride in the quality of their products. Pintail’s adaptive test techniques provide monitoring in real-time, enabling a new level of quality control that would be impossible with traditional post-processing methods.
- SPC Monitoring in real-time guarantees consistent quality
- Outlier detection and extraction at both probe and final test minimizes field defects
- Outlier detection can reduce the need for costly burn-in
- Proven in production
Real-time SPC Monitoring Insures Consistent Quality
Even in the highest quality organizations, undetected test issues can escape detection and cause embarrassment at your customers. Maverick lots or undesirable excursions in your test process can also create costly interruptions to your job flow.
Traditional methods like statistical bin limits (SBL) cannot catch problems that arise when the handler passes a bad part forward because the tester has mistakenly reported a good result. If your test operations have real-time monitoring in place following Western Electric Company (WECO) trend rules, these conditions will be caught immediately and prevented.
TestScape-SPC is a comprehensive solution that provides consistent, on-line monitoring of test results. TestScape-SPC is easy to install, easy to learn and easy to own.
Outlier Detection and Rejection
If you are in the automotive or medical electronics markets, you are well aware of the demand to run outlier detection on all parts in order to eliminate potential field failures. Dynamic parts average testing (DPAT) has been popular for its simplicity, but usually generates unnecessary yield loss. Pintail’s SwifTest-FOX includes very sophisticated outlier algorithms that minimize yield loss while pin pointing true outliers. SwifTest-FOX may be applied on a single die (e.g. multiple measures of Iddq) or on an entire wafer (post-processing).
Many companies are doing this at probe because post-processing techniques are obvious solutions for this task. Of course, most people realize that “if it were their air bag,” they would prefer outlier screening to be performed at final test. However, few people in the industry have the technology to do outlier screening at final test without disrupting production flow.
That’s why Pintail has developed a unique solution for multiple ATE platforms that performs PAT at final test.
Burn-In Strategies
PAT at final test is critical because it is usually the most practical way of testing parts under all temperature conditions. SwifTest-FOX permits full outlier screening under all final test conditions.
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